Laser drilling principle

The laser beam focuses the spot at the appropriate position according to the thickness of the workpiece. High-speed scanning movement on the workpiece according to the preset path and interaction with the workpiece under the action of the high-energy laser beam, peeling off the target area layer by layer to form a cutting street to accomplish the ablation of the preset empty area (round, square, shaped).

Processing advantages

✓ Platform size can be customised for flexible use;

✓ Special-shaped drilling is simple and convenient, and can be formed in one step;

✓ Small chipping of drilling edges and flat processing surface;

✓ Seamless switching of production of various specifications, simple operation, easy to use;

✓ Low operating cost, high yield rate, no consumables, no pollution;

✓ Will not scratch the product surface.

Process Application

Suitable for drilling, grooving, film removal and sandblasting of various brittle and hard materials such as ordinary glass, optical glass, quartz, sapphire, strengthened glass, optical filters, mirrors, etc.