Laser Glass Cutting Machine (Single)

  • Detail
  • Parameters


Laser cutting principle

The laser generates ultra-short pulses with extremely high energy and interacts with the workpiece in a very short time. When the beam propagates and acts in the material, it destroys its stress structure to form micron-sized filaments. Micro-cracks are formed by optimizing the spatial distance, and the cutting is achieved with the break process.


Processing advantages

High speed processing of shaped workpiece;

Zero taper on cutting edges, small chipping, no hand injury;

Seamless switching of production of various specifications, simple operation, easy to use;

Low operating cost, high yield rate, no consumables, no pollution;

It does not produce waste residue, waste liquid or waste water and will not scratch the surface of the product.


Process Application

Suitable for cutting various hard and brittle materials, such as ordinary glass, optical glass, quartz, sapphire, strengthened glass, optical filters, mirrors, etc. The internal holes can also be taken for specific dimensions.

Work Platform
Single Platform
Laser Type
IR Picosecond
Application
Optical Glass, Quartz, Sapphire...etc
Customizable
Yes
Platform Size
500*600mm
Cutting Thickness
0.03-20mm
Cutting Speed
0-1000mm/s
Cutting Edge
0.01mm max
Cooling Method
Water Cooling
Power Supply
AC220V±5%, 50/60Hz
Finished products showcase
ABUIABACGAAg6O2XuAYol7m3iwYwwAw4hAc
Quote Sheet
+86
Quote Now